UB Group and Kaynes Semicon Partner to Advance Lights-Out Semiconductor Manufacturing
New Delhi, September 2026 – UB Group, through United BC Team Sdn. Bhd., has formalized a strategic collaboration with Kaynes Semicon to explore advanced intralogistics and lights-out automation solutions for semiconductor manufacturing, supporting the industry's growing need for greater operational efficiency, precision and manufacturing scalability.
The Memorandum of Understanding (MoU), exchanged at SEMICON India 2026 in New Delhi, establishes a framework for both companies to evaluate integrated automation technologies and develop a phased roadmap toward smarter, more connected semiconductor manufacturing environments.
The collaboration will focus on several key areas, including automated work-in-progress (WIP) movement, Overhead Hoist Systems (OHS), Autonomous Mobile Robots (AMR), automated storage and intelligent material management.
These technologies play an increasingly important role in modern semiconductor facilities, where efficient material movement, optimized space utilization and reduced manual intervention are essential to supporting high-precision manufacturing operations.
By exploring the integration of these systems, the collaboration aims to identify opportunities to improve factory-wide material flow, operational productivity and automation readiness.
The MoU was exchanged by Raghu Panicker, Chief Executive Officer of Kaynes Semicon, and Tan WH, Chief Executive Officer of UB Group, during SEMICON India 2026, which brought together senior government officials and semiconductor industry leaders, including Shri Ashwini Vaishnaw, India's Union Minister for Electronics and Information Technology.
Toward More Integrated Semiconductor Operations
The partnership reflects an important industry direction as semiconductor manufacturers look beyond individual equipment automation toward more intelligent, interconnected factory operations.
For UB Group, this approach builds on its experience in integrating material handling technologies, automated storage systems and manufacturing digitalization solutions to address complex production requirements.
The proposed collaboration with Kaynes Semicon will provide a framework to evaluate how these capabilities can be applied to evolving semiconductor manufacturing needs, with the longer-term objective of supporting greater process integration and reduced reliance on manual material handling.
As India continues to expand its semiconductor manufacturing ecosystem, the partnership also presents opportunities for closer Malaysia–India technology collaboration, combining industrial expertise and practical automation capabilities to support future manufacturing requirements.
The MoU represents a step toward exploring advanced automation applications and developing a foundation for increasingly intelligent semiconductor manufacturing environments.
